Nation of Principal：Japan Product Application：Advanced IC Packages Related Link：http://www.hitachi-power-solutions.com/products/product02/p02_91_01.html Keyword：Fanout,plating,FOPLP
1.Ni-Solder continuous plating 2.Suitable for (Cu/Ni/SnAg, Cu/Ni/Au) fan-out package substrate plating 3.Handles ne pitch pattern plating 4.Duplex simultaneous treatment and high throughput with compact
